产品与技术
首创在线式多层反应腔双真空系统,占地面积不变,产能翻倍
OAK-DU-5 with dual react-chamber doubled throughput and kept the same floor space of OAK-U-5.
等离子体快速稳定(稳定时间~0.3秒),RF频率可选13.56MHz和40.68MHz
Plasma stabilized within 0.3 seconds with either 13.56 or 40.68 MHz.
整个CVD工艺过程处于超洁净环境,无交叉污染
The entire CVD processes are under no contamination and super clean environment
从晶舟至晶舟全自动化生产,无皮带电池片传输
Cassette in, cassette out, wafer load and unload, fully automated without using belt to transfer wafers
优化的工艺及在线式托盘清洗,最大限度提高设备产能
In-line auto-cleaning of wafer carriers integrated with PECVD deposition processes to provide maximum throughout
配备等离子体自清洗系统,保持反应腔洁净,无需开腔体维护,增加正常运行时间
Dry Clean: keeps chamber complete clean, no need to open chamber clean with better uptime
反应腔体体积小,节省工艺气体的消耗量(仅为传统的~1/8)
Smaller reactor chamber design, saves special reactive gases usage (only ~1/8 of traditional chamber)
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