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异质结生产 OAK-DU-5

装备系统特点 Unique Features:

  首创在线式多层反应腔双真空系统,占地面积不变,产能翻倍

    OAK-DU-5 with dual react-chamber doubled throughput and kept the same floor space of OAK-U-5.
 

   等离子体快速稳定(稳定时间~0.3秒),RF频率可选13.56MHz和40.68MHz

    Plasma stabilized within 0.3 seconds with either 13.56 or 40.68 MHz.

 

   整个CVD工艺过程处于超洁净环境,无交叉污染

    The entire CVD processes are under no contamination and super clean environment

 

   从晶舟至晶舟全自动化生产,无皮带电池片传输

    Cassette in, cassette out, wafer load and unload, fully automated without using belt to transfer wafers

 

   优化的工艺及在线式托盘清洗,最大限度提高设备产能

    In-line auto-cleaning of wafer carriers integrated with PECVD deposition processes to provide maximum throughout

 

   配备等离子体自清洗系统,保持反应腔洁净,无需开腔体维护,增加正常运行时间

    Dry Clean: keeps chamber complete clean, no need to open chamber clean with better uptime

 

  反应腔体体积小,节省工艺气体的消耗量(仅为传统的~1/8)

    Smaller reactor chamber design, saves special reactive gases usage (only ~1/8 of traditional chamber)

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